Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems

A microelectronic device, comprising:

• a solid-state drive (SSD) memory device on an electrical contact array of a package board;
• and
• a package stiffener device above a first side of the package board, the package stiffener device horizontally positioned proximate the SSD memory device and comprising:
• an upper stiffener above the first side of the package board and including a die side and a package side;
• a lower stiffener including a damper side and a board side, the lower stiffener comprising through-package anchors vertically extending from the board side and completely through the package board;
• and
• a damper device vertically interposed between and physically contacting each of the upper stiffener and the lower stiffener.

An electronic system, comprising:

• an input device;
• an output device;
• a processor device operably coupled to the input device and the output device;
• and
• a memory device package operably coupled to the processor device, and comprising:
• a solid-state drive (SSD) memory device over an electrical contact array of a package board;
• a package stiffener device physically attached to the package board and comprising:
• an upper stiffener;
• a lower stiffener between the upper stiffener and the package board, the lower stiffener comprising:
• a main body structure;
• and
• anchor structures integral with and vertically extending from the main body structure, the anchor structures physically attached to and vertically extending completely through the package board;
• and
• a damper device vertically between and in direct physical contact with each of the upper stiffener and the lower stiffener.