Electrical module and printed circuit board assembly comprising an electrical module

An electrical module comprising:

• an upper side and an underside, the upper side having four rectangularly arranged side edges;
• an electrical component embedded in the electrical module;
• at least three electrical solder pads formed on the upper side, wherein each electrical solder pad is configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer, wherein the at least three electrical solder pads of the electrical module:
• (1) are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or (2) are arranged axially symmetrically on the upper side of the electrical module;
• and
• a ceramic circuit carrier having an insulating ceramic layer and a first metallization layer disposed on an upper side of the ceramic layer,
• wherein the electrical component is disposed on and electrically connected to an upper side of the first metallization layer, and
• wherein the electrical contacts of the electrical module comprise at least one first via that extends from a first electrical solder pad of the at least three electrical solder pads on the upper side of the electrical module to the first metallization layer, and second and third vias that extend from additional electrical solder pads of the at least three electrical solder pads on the upper side of the electrical module to corresponding contacts on the upper side of the electrical component.

A circuit board assembly comprising:

• a circuit board having an upper side and an underside;
• a plurality of electrical modules connected to the circuit board, wherein each electrical module of the plurality of electrical modules has an upper side and an underside, wherein the upper side of the electrical module is arranged on the underside of the circuit board,
• wherein the upper side of each electrical module of the plurality of electrical modules has four rectangularly arranged side edges,
• wherein an electrical component is embedded in each electrical module of the plurality of electrical modules;
• and
• wherein at least three electrical solder pads are positioned on the upper side on each electrical module of the plurality of electrical modules, wherein each electrical solder pad is configured to make electrical contact with the electrical component, and wherein at least one solder pad of the at least three electrical solder pads extends on each edge of two opposite side edges of the four rectangularly arranged side edges,
• wherein additional electrical solder pads are positioned on an underside of the circuit board and are connected with the at least three electrical solder pads on the upper side of the electrical module via respective solder layers, and
• wherein the at least three electrical solder pads of each electrical module of the plurality of electrical modules:
• (1) are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or (2) are arranged axially symmetrically on the upper side of the electrical module,
• wherein the plurality of electrical modules is arranged in two rows on the circuit board and in each case two adjacent electrical modules of the two rows being aligned such that the side edges provided with electrical solder pads are aligned with one another and extend perpendicularly to a longitudinal direction of the respective row of the two rows,
• wherein a washing agent is configured to flow through each electrical module of two adjacent electrical modules of the two rows at an intermediate stage of a manufacture of the circuit board assembly, and
• wherein a flow of the washing agent flow is configured to extend between the circuit board and the upper side of the respective electrical module and thereby between the electrical solder pads positioned on the two opposite side edges.