Arrangement of pads and through-holes for semiconductor packages

An arrangement of mounting pads on a substrate for connection with electrical contacts, comprising:

• a plurality of segments;
• a first segment of said plurality having a plurality of the mounting pads in a first row, a plurality of the mounting pads in a second row, and a plurality of the mounting pads in a third row;
• each of said first row mounting pads, said second row mounting pads, and said third row mounting pads in connection with an offset through-hole oriented outwardly in a first direction that is substantially parallel to a first bisector for said first segment;
• and
• wherein each of said second and third rows has an outermost mounting pad in connection with an offset through-hole oriented outwardly in a direction other than said first direction.

An arrangement of mounting pads on a substrate for connection with electrical contacts, comprising:

• a first segment having a plurality of the mounting pads in a first row;
• each of said first row mounting pads in connection with an offset through-hole oriented outwardly in a first direction that is substantially parallel to a diagonal of an outer shape of the arrangement;
• and
• a second segment having a plurality of the mounting pads in a second segment first row, each of said second segment first row mounting pads in connection with an offset through-hole oriented outwardly in a second direction that is substantially parallel to a second bisector for said second segment.

A layer of a multi-layer circuit board having an arrangement of conductively-lined through-holes for electrical connection between layers, the arrangement comprising:

• a first and second segment, each having a plurality of generally parallel rows of the through-holes;
• the spacing between said first and second segments being generally greater than that between said rows within either of said first and second segments;
• said conductive lining of each of the through-holes is in connection with a mounting pad located on an outer side of the layer;
• and
• each of said through-holes of said first segment is offset from said interconnected mounting pad in an outwardly direction that is substantially parallel to a first bisector for said first segment.