Apparatuses including stiffener devices
AssigneeMicron Technology, Inc.
InventorsPrasad Nagavenkata Nune, Christopher Glancey, Yeow Chon Ong, Hong Wan Ng
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AssigneeMicron Technology, Inc.
InventorsPrasad Nagavenkata Nune, Christopher Glancey, Yeow Chon Ong, Hong Wan Ng
Estimating the term…
A microelectronic device package assembly includes a package board and a stiffener device attached to the package board. The package board has a first side and a second side. The stiffener device includes an upper stiffener, a lower stiffener, and one or more damper devices. The upper stiffener is above the first side of the package board and has a die side and a package side. The lower stiffener is interposed between the upper stiffener and the package board and has a damper side and a board side. The lower stiffener includes through-package anchors extending from the board side and through the package board. The one or more damper devices are interposed between and are in contact with each of the upper stiffener and the lower stiffener. Microelectronic devices and electronic systems are also described.
An apparatus, comprising:
An apparatus, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.