US 4,833,568 A · Three-dimensional circuit component assembly and method corresponding thereto

Abstract

A plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid. Each carrier package houses one or more electrical circuit components and is provided at portions of the flat faces thereof with electrical contacts which cooperate with similarly located contacts on the flat faces of adjacent carrier packages to electrically interconnect the circuit components. The electrical contacts may take the form of a cooperating system of pins and apertures, serving also to align adjacent carrier packages. The carrier package assembly is useable in cooperation with a flexible, printed circuit board having on one side thereof an array of contact sites selectively interconnected by printed routing traces. Electrical contacts on the peripheral surfaces of the carrier packages are coupled with the circuit components housed therein and engage the contact sites on the circuit board when it is wrapped around the carrier package assembly. The ends of the carrier package assembly are fitted with connector blocks of a convenient shape which serve to support the carrier package assembly and to interconnect the electrical components therein with others exterior thereto. Several types of circuit boards and a variety of carrier package shapes are disclosed.

Claims64

Dependent claims

A three-dimensional component assembly comprising:

(a) a self-supporting housing enclosing within the sides thereof a plurality of electrical circuit components;
(b) electrical contacts on said sides of said housing electrically coupled to said components enclosed therein;
and
(c) wrapping means for electrically interconnecting selected of said electrical contacts, said wrapping means comprising:
i. an electrically insulative substrate encircling said housing against said sides thereof;
ii. contact sites on said substrate, said contact sites engaging said electrical contacts on said housing when said substrate encircles said housing;
and
iii. electrically conductive routing traces on said substrate selectively interconnecting said substrate selectively interconnecting individual of said contact sites.

5 more elements

A three-dimensional circuit component assembly comprising a sequence of stackable carrier packages for electronic circuit components, the carrier packages being positioned adjacent one to another to form a prismatic carrier package assembly having parallel ends and sides normal thereto, each of said carrier packages comprising:

(a) a carrier plate having an integrated circuit semiconductor chip contained therein, said carrier plate having opposed faces parallel to the plane of the semiconductor chip and sides extending between the peripheries of said faces;
(b) register means for aligning one of said faces of said carrier plate in a mating relationship with a face of a distinct carrier plate located adjacent thereto in said carrier package assembly;
(c) a plurality of electrical contacts spaced about the circumference of said carrier plate on said sides thereof, said electrical contacts being so configured and disposed as to be engaged individually by a corresponding number of contact sites selectively interconnected on a flexible circuit board wrapped around said carrier package assembly against said said sides of said carrier plates therein;
(d) electrical wiring coupling corresponding of the leads of said integrated circuit semiconductor chip to said electrical contacts;
and
(e) an electrical contact on each of said faces of said carrier plate, said electrical contacts being electrically coupled to each other through said plate and being so positioned on each of said faces of said carrier plate as to effect an electrical connection with a distinct carrier plate located adjacent thereto in the carrier package assembly.

3 more elements

A three-dimensional circuit component assembly comprising:

(a) a sequence of congruent carrier plates, each of said plates having therein an electrical circuit component and being provided at the periphery thereof with an electrical contact coupled to said circuit component, said carrier plates being stacked against and parallel one to another in a prismatic carrier plate assembly having parallel ends and sides normal thereto;
(b) register means for aligning said plates with said faces thereof in a mating relationship;
and
(c) wrapping means for electrically interconnecting said electrical circuit components in a direction parallel the longitudinal axis of said carrier plate assembly, said wrapping means encircling said carrier plate assembly against said sides thereof engaging said electrical contacts and said wrapping means comprising:
i. an electrically insulative substrate encircling said carrier assembly against said sides thereof;
ii. contact sites on said substrate, said contact sites engaging said electrical contacts when said substrate encircles said carrier plate assembly;
and
iii. electrically conductive routing traces on said substrate selectively interconnecting individual of said contact sites.

5 more elements

A three-dimensional circuit component assembly comprising:

(a) a sequence of electrically insulative circuit component carrier packages, each of said carrier packages having a pair of opposed parallel faces congruent with each other and with said faces of other of said carrier packages and having embedded therein an electrical circuit component, said carrier packages being positioned adjacent one to another with said faces of adjacent of said carrier packages in a mating relationship to form a prismatic carrier package assembly having parallel ends and sides normal thereto;
(b) an electrical contact on each of said carrier packages electrically coupled with said electrical circuit component embedded therein, said electrical contacts being located on said sides of said carrier package assembly when said carrier packages are positioned therein;
and
(c) a flexible circuit board provided with contact sites and conductive routing traces selectively interconnecting individual of said contact sites, said circuit board encircling said carrier package assembly against said sides thereof with said contact sites engaging said electrical contacts on said carrier packages.

1 more element

A method for assembling a plurality of circuit components in close proximity in a three-dimensional spatial and electrical relationship, the method comprising:

(a) housing the circuit components in a plurality of circuit component carrier packages having sides and normal thereto opposed parallel faces congruent to each other and to said faces of other of said carrier packages;
(b) assembling said plurality of carrier packages adjacent one to another with one of said faces of each pair of adjacent carrier packages in mating contact to form a prismatic carrier package assembly having parallel ends, sides normal thereto, and a cross-section substantially congruent to said faces of said carrier packages;
and
(c) selectively interconnecting the circuit components in a direction parallel the longitudinal axis of said carrier package assembly and a direction circumferential thereto.

1 more element

Dependencies are inferred from the claim text.

Three-dimensional circuit component assembly and method corresponding thereto

Life of this patent

Three-dimensional circuit component assembly and method corresponding thereto

Life of this patent

Abstract

Claims64