H05K 2201/09436
Pads or lands on permanent coating which covers the other conductors
H05K2201/09436 (Pads or lands on permanent coating which covers the other conductors) appears on 165 US grants and 194 published applications in this corpus.
Search patents in H05K- Granted patents
- 165
- Published applications
- 194
- Assignees
- 107
- Inventors
- 343
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 4 |
| 2003 | 3 | 6 |
| 2004 | 5 | 8 |
| 2005 | 7 | 14 |
| 2006 | 5 | 17 |
| 2007 | 6 | 22 |
| 2008 | 15 | 16 |
| 2009 | 10 | 15 |
| 2010 | 8 | 19 |
| 2011 | 16 | 18 |
| 2012 | 16 | 7 |
| 2013 | 12 | 6 |
| 2014 | 6 | 7 |
| 2015 | 2 | 7 |
| 2016 | 6 | 5 |
| 2017 | 4 | 4 |
| 2018 | 1 | 2 |
| 2019 | 5 | 3 |
| 2020 | 4 | 3 |
| 2021 | 2 | 2 |
| 2022 | 2 | 3 |
| 2023 | 3 | 3 |
| 2024 | 2 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Manufacturing method of electronic device28 Oct 2025US 12,457,005 B2Innolux Corporation
- Wiring substrate22 Oct 2024US 12,127,340 B2KYOCERA Corporation
- Shielded electronic component package16 Jul 2024US 12,040,305 B2Amkor Technology Singapore Holding Pte.Ltd.
- Shielded electronic component package9 May 2023US 11,646,290 B2Amkor Technology Singapore Holding Pte.Ltd.
- Ceramic electronic component9 May 2023US 11,647,581 B2Murata Manufacturing Co., Ltd.
- Package substrate and fabricating method thereof13 Aug 2026US 2026/0239533 A1AaltoSemi Inc.
- Electronic device8 Jan 2026US 2026/0012221 A1Innolux Corporation
- Package structure and method for manufacturing package structure28 Dec 2023US 2023/0420343 A1Changxin Memory Technologies, Inc.
- Shielded electronic component package31 Aug 2023US 2023/0275061 A1Amkor Technology Singapore Holding Pte.Ltd.
- Electronic device15 Jun 2023US 2023/0187594 A1Innolux Corporation
Most cited
By later US patents
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Fine pitch bumping with improved device standoff and bump volume101US 6,372,622 B1Motorola, Inc. · 2002
- Method of manufacture of multilayer circuit board94US 5,317,801 ANippon Mektron, Ltd. · 1994
- Printed circuit board comprising elevated bond pads86US 5,523,920 AMotorola, Inc. · 1996