Manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• providing a substrate;
• forming a first opening so that the first opening penetrates the substrate;
• and
• forming a polymer layer in the first opening, wherein the polymer layer is in contact with a sidewall of the substrate at the first opening;
• forming a first conductive layer pattern on a surface of the substrate;
• forming a second conductive layer pattern on another surface of the substrate, wherein the another surface is opposite to the surface;
• and
• forming a second opening in the polymer layer, wherein the second opening exposes the second conductive layer pattern;
• wherein before forming the second opening in the polymer layer, the manufacturing method further comprises:
• forming a dielectric layer on the surface of the substrate to cover the first conductive layer pattern;
• forming a conductive layer pattern on the dielectric layer so that the conductive layer pattern is electrically coupled to the first conductive layer pattern.