Electronic device

Abstract

An electronic device includes a substrate, a first conductive layer pattern, a second conductive layer pattern, a first opening, a dielectric layer, a third conductive layer pattern and a chip. The first conductive layer pattern is disposed on a surface of the substrate. The second conductive layer pattern is disposed on another surface of the substrate. The another surface is opposite to the surface. The first opening penetrates the surface and the another surface. The dielectric layer is disposed on the surface and covers the first conductive layer pattern. The third conductive layer pattern is disposed on the dielectric layer and electrically coupled to the first conductive layer pattern through a second opening penetrated the dielectric layer. The chip is disposed on the substrate and electrically coupled to the third conductive layer pattern through a first solder ball. The second opening tapers toward and misalign with the first opening.

Dependencies are inferred from the claim text.