Wiring substrate

A wiring substrate comprising:

• an insulation layer disposed at an outermost layer;
• an electrode conductor disposed at a surface of the insulation layer with a seed layer being interposed between the electrode conductor and the insulation layer;
• a nickel layer configured to cover at least one of the electrode conductors and include a contact portion that comes into contact with a surface of the seed layer;
• and
• a gold layer configured to cover the nickel layer, wherein
• the nickel layer includes a plurality of gaps at the contact portion,
• at least a portion of the gaps includes an opening toward the contact portion, and
• a portion of the gold layer is disposed in at least the portion of the gaps,
• wherein
• the nickel layer includes:
• a first nickel layer disposed on the electrode conductor;
• and
• a second nickel layer disposed at an outer periphery of the electrode conductor, and
• a thickness of the second nickel layer is smaller than a thickness of the first nickel layer.