Package structure and method for manufacturing package structure
AssigneeChangxin Memory Technologies, Inc.
InventorHuifang DAI
Life of this patent
Estimating the term…
Abstract
A package structure includes: a substrate, where a plurality of welding pads are disposed on a surface of the substrate, each of the plurality of welding pads includes a bottom layer welding pad and a top layer welding pad which are stacked onto one another, and at least two of peripheral surfaces of the top layer welding pad are protruded relative to peripheral surfaces of the bottom layer welding pad; a chip located on the substrate and spaced apart from the substrate; and a plurality of solder balls, where the plurality of solder balls are welded to the substrate and the chip, and the plurality of solder balls wrap the top layer welding pads.
Claims18
A package structure, comprising:
- a substrate, wherein at least one welding pad is disposed on a surface of the substrate, the at least one welding pad comprising a bottom layer welding pad and a top layer welding pad which are stacked onto one another, and at least two of peripheral surfaces of the top layer welding pad being protruded relative to peripheral surfaces of the bottom layer welding pad;
- a chip located on the substrate and spaced apart from the substrate;
- and
- at least one solder ball, wherein the at least one solder ball is welded to the substrate and the chip, and the at least one solder ball wraps the top layer welding pad.
A method for manufacturing a package structure, comprising:
- providing a substrate, and forming a plurality of welding pads on a surface of the substrate, wherein each of the plurality of welding pads comprises a bottom layer welding pad and a top layer welding pad which are stacked onto one another, and at least two of peripheral surfaces of the top layer welding pad are protruded relative to peripheral surfaces of the bottom layer welding pad;
- providing a chip;
- and
- welding the chip to the plurality of welding pads through a plurality of solder balls, wherein each of the plurality of solder balls wraps a respective one of the top layer welding pads.
Dependencies are inferred from the claim text.