Method for fabricating semiconductor components using focused laser beam

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a first surface and a second surface;
• laser machining an opening in the substrate from the first surface to the second surface using a laser beam;
• selecting a focal point of the laser beam to form the opening with at least one enlarged end portion;
• depositing a conductive material into the opening to form a conductive via;
• and
• forming a contact on the enlarged end portion.

A method for fabricating a semiconductor component comprising:

• providing a substrate;
• laser machining an opening in the substrate using a laser beam;
• selecting a focal point of the laser beam to form the opening with a sidewall;
• depositing a layer of a conductive material on the sidewall to form a conductive via;
• forming a contact on the substrate comprising a peripheral ridge formed by the layer and configured to retain a ball contact;
• and
• bonding the ball contact to the contact.

A method for fabricating a semiconductor component comprising:

• providing a substrate;
• laser machining an opening in the substrate using a laser beam;
• selecting a focal point of the laser beam to form the opening with at least one enlarged end portion;
• depositing a conductive polymer through the enlarged end portion into the opening to form a conductive via;
• placing a contact ball on the conductive polymer;
• and
• curing the conductive polymer.

A method for fabricating a semiconductor component comprising:

• providing a silicon substrate comprising a first surface and a second surface;
• laser machining an opening in the substrate from the first surface to the second surface using a laser beam;
• selecting a focal point of the laser beam to form the opening with a desired geometry;
• forming an insulating layer in the opening;
• depositing a conductive material into the opening to form a conductive via;
• forming a first contact on the first surface in electrical communication with the conductive via;
• and
• forming a second contact on the second surface in electrical communication with the conductive via.

A method for fabricating a semiconductor component comprising:

• providing a semiconductor die comprising a bond pad;
• providing a substrate comprising a first surface and a second surface;
• laser machining an opening in substrate from the first surface to the second surface using a laser beam;
• selecting a focal point of the laser beam to form the opening with a desired geometry;
• depositing a conductive material into the opening to form a conductive via comprising a first contact and a second contact;
• bonding the bond pad to the first contact;
• and
• bonding a contact ball to the second contact.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a first surface and a second surface;
• laser machining an opening in the substrate from the first surface to the second surface using a laser beam;
• selecting a focal point of the laser beam to form the opening with a desired geometry;
• depositing a conductive material into the opening to form a conductive via;
• forming a first contact on the first surface configured to electrically engage an external contact on a semiconductor die or package;
• and
• forming a second contact on the second surface configured to electrically engage a test apparatus.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a first surface and a second surface;
• laser machining an opening in the substrate from the first surface to the second surface using a laser beam;
• selecting a focal point of the laser beam to form the opening with an enlarged end portion;
• depositing a conductive material into the opening to form a conductive via;
• forming a contact on the enlarged end portion;
• and
• bonding a wire to the contact configured to electrically engage a semiconductor die.