H05K 2201/094
Array of pads or lands differing from one another
Official title: Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
H05K2201/094 (Array of pads or lands differing from one another) appears on 603 US grants and 611 published applications in this corpus.
Search patents in H05K- Granted patents
- 603
- Published applications
- 611
- Assignees
- 309
- Inventors
- 1,436
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 10 | 0 |
| 1999 | 10 | 0 |
| 2000 | 11 | 0 |
| 2001 | 18 | 7 |
| 2002 | 20 | 28 |
| 2003 | 21 | 20 |
| 2004 | 21 | 21 |
| 2005 | 11 | 29 |
| 2006 | 17 | 23 |
| 2007 | 24 | 28 |
| 2008 | 16 | 41 |
| 2009 | 16 | 32 |
| 2010 | 34 | 23 |
| 2011 | 15 | 18 |
| 2012 | 22 | 16 |
| 2013 | 15 | 12 |
| 2014 | 10 | 17 |
| 2015 | 15 | 23 |
| 2016 | 23 | 21 |
| 2017 | 20 | 23 |
| 2018 | 26 | 19 |
| 2019 | 14 | 23 |
| 2020 | 23 | 30 |
| 2021 | 23 | 30 |
| 2022 | 25 | 30 |
| 2023 | 25 | 32 |
| 2024 | 25 | 24 |
| 2025 | 18 | 20 |
| 2026 | 17 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board with reflective layers having hollows, and an electronic apparatus1 Sep 2026US 12,727,076 B2Boe Technology Group Co., Ltd.
- Differential transmission board set and assembly9 Jun 2026US 12,652,773 B2Japan Aviation Electronics Industry, Limited
- Data cable and electronic device2 Jun 2026US 12,646,892 B2Vivo Mobile Communication Co., Ltd.
- Circuit board having an edge containing conductive regions2 Jun 2026US 12,648,082 B2Teradyne, Inc.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Higher current surface mount pads and circuit assembly24 Sep 2026US 2026/0292979 A1
- Component carrier with stacked electrically conductive layers, embedded and on the surface17 Sep 2026US 2026/0282223 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- System for computer peripheral bus for allowing hot extraction on insertion without disrupting adjacent devices201US 5,210,855 AInternational Business Machines Corporation · 1993
- Method of bumping substrates by contained paste deposition146US 5,539,153 AHewlett-Packard Company · 1996
- Connecting structure for connecting a memory unit to a memory unit controller123US 4,849,944 ATokyo Electric Co., Ltd. · 1989
- Integrated circuit having a coplanar solder ball contact array115US 5,435,482 ALSI Logic Corporation · 1995
- Ball grid array having reduced mechanical stress109US 5,598,036 AIndustrial Technology Research Institute · 1997