Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Min LEE, Francis SAYNES, Keun Woo KWON
Life of this patent
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Abstract
A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.
Claims10
A printed circuit board comprising:
- a first insulating layer;
- a plurality of first and second pads disposed on the first insulating layer;
- a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads;
- and
- a surface treatment layer disposed on the first and second pads,
- wherein the first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening, and
- the second pad has only a closed region having a side surface covered by the solder resist layer.
A printed circuit board comprising:
- a first insulating layer;
- a plurality of first and second pads disposed on the first insulating layer;
- a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads;
- a circuit pattern disposed on a lower surface of the first insulating layer;
- and
- a via passing through the first insulating layer and connecting the first and second pads and the circuit pattern to each other,
- wherein the first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening, and
- the second pad has only a closed region having a side surface covered by the solder resist layer.
Dependencies are inferred from the claim text.