Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Min Lee, Francis Saynes, Keun Woo Kwon
Life of this patent
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Abstract
A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.
Claims17
A printed circuit board comprising:
- a first insulating layer;
- a plurality of first and second pads disposed on the first insulating layer;
- and
- a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads;
- wherein the first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening,
- wherein the second pad has only a closed region having a side surface covered by the solder resist layer, and
- wherein a distance between the closed region of the first pad and the second pad adjacent to the closed region of the first pad is shorter than a distance between open regions of the first pads adjacent to each other.
A printed circuit board comprising:
- an insulator having first openings and second openings;
- and
- first pads and second pads covered by the insulator,
- wherein each of the first openings exposes at least a portion of an upper surface of each of the first pads and at least a portion of a side surface of each of the first pads, and does not expose another portion of the side surface of each of the first pads,
- wherein each of the second openings exposes at least a portion of an upper surface of each of the second pads, and does not expose a side surface of each of the second pads, and
- wherein a shortest distance, measured in plan view, between a covered side-surface portion of a first pad and a side surface of an adjacent second pad is less than a shortest distance, measured in plan view, between exposed side-surface portions of two adjacent first pads.
A printed circuit board comprising:
- an insulating layer;
- a first pad and a second pad disposed on the insulating layer;
- and
- a solder resist layer disposed on the insulating layer, the solder resist layer having a first opening exposing not entire of an upper surface of the first pad and a second opening exposing only a portion of an upper surface of the second pad,
- wherein among the first opening and the second opening, only the first opening exposes a portion of the insulating layer,
- wherein the solder resist layer covers only portions of edges of the upper surface of the first pad, and covers all edges of the upper surface of the second pad, and
- wherein an edge of the upper surface of the first pad and an edge of the upper surface of the second pad are inclined with respect to an arrangement direction of the first pad and the second pad on the insulating layer.
Dependencies are inferred from the claim text.