H05K 2201/09454
Inner lands, i.e. lands around via or plated through-hole in internal layer
Official title: Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
H05K2201/09454 (Inner lands, i.e. lands around via or plated through-hole in internal layer) appears on 149 US grants and 159 published applications in this corpus.
Search patents in H05K- Granted patents
- 149
- Published applications
- 159
- Assignees
- 92
- Inventors
- 379
- Latest grant
- 25 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 2 |
| 2002 | 5 | 4 |
| 2003 | 4 | 6 |
| 2004 | 5 | 10 |
| 2005 | 5 | 9 |
| 2006 | 10 | 7 |
| 2007 | 3 | 6 |
| 2008 | 9 | 15 |
| 2009 | 4 | 11 |
| 2010 | 9 | 14 |
| 2011 | 10 | 10 |
| 2012 | 8 | 7 |
| 2013 | 8 | 2 |
| 2014 | 4 | 3 |
| 2015 | 8 | 4 |
| 2016 | 1 | 1 |
| 2017 | 4 | 0 |
| 2018 | 2 | 6 |
| 2019 | 4 | 6 |
| 2020 | 6 | 7 |
| 2021 | 6 | 3 |
| 2022 | 4 | 7 |
| 2023 | 2 | 2 |
| 2024 | 5 | 3 |
| 2025 | 2 | 8 |
| 2026 | 0 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001
- High frequency printed circuit board via98US 6,538,538 B2FormFactor, Inc. · 2003
- Passive transmission line equalization using circuit-board thru-holes81US 6,812,803 B2Force10 Networks, Inc. · 2004
- Metal core multilayer resin wiring board with thin portion and method for manufacturing the same75US 6,323,439 B1Ngk Spark Plug Co., Ltd. · 2001
- High frequency printed circuit board via74US 6,661,316 B2FormFactor, Inc. · 2003