Back to results
US 6,661,316 B2Granted
High frequency printed circuit board via
AssigneeFormFactor, Inc.
InventorsEmad B. Hreish, Charles A. Miller
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
Claims17
A method of making a wiring substrate, said method comprising:
- providing a substrate comprising:
- a first surface and a second surface spaced apart and parallel to one another;
- a first conductive strip residing on the first surface of the substrate;
- a second conductive strip residing on the second surface of the substrate;
- and
- a conductive link contacting said first conductive strip and said second conductive strip;
- and
- adding shunt capacitance to said conductive link;
- wherein said shunt capacitance is sized to optimize a frequency response characteristic of a conductive path comprising said first conductive strip, said second conductive strip, and said conductive link.
6 more elements
A method of making a wiring substrate, said method comprising:
- providing a substrate comprising a first conductive strip, a second conductive strip, and a conductive link electrically interconnecting said first conductive strip and said second conductive strip;
- and
- adding capacitance to said conductive link;
- and
- sizing said capacitance to optimize a frequency response characteristic of a conductive path comprising said first conductive strip, said second conductive strip, and said conductive link, wherein said first conductive strip is embedded within said substrate.
2 more elements
A method of making a wiring substrate, said method comprising:
- providing a substrate comprising a first conductive strip, a second conductive strip, and a conductive link electrically interconnecting said first conductive strip and said second conductive strip;
- adding capacitance to said conductive link;
- and
- sizing said capacitance to optimize a frequency response characteristic of a conductive path comprising said first conductive strip, said second conductive strip, and said conductive link, and
- changing a characteristic impedance of said first conductive strip.
2 more elements
A method of making a wiring substrate, said method comprising:
- providing a substrate comprising a first conductive strip, a second conductive strip, and a conductive link electrically interconnecting said first conductive strip and said second conductive strip;
- and
- adding capacitance to said conductive link;
- and
- sizing said capacitance to optimize a frequency response characteristic of a conductive path comprising said first conductive strip, said second conductive strip, and said conductive link, wherein
- said first conductive strip resides on an upper surface of said substrate;
- said second conductive strip resides on a lower surface of said substrate;
- said conductive link is embedded within said substrate;
- and
- said capacitance comprises a pad embedded within said substrate and electrically connected to said conductive link.
7 more elements
A method of making a wiring substrate, said method comprising:
- providing a substrate comprising a first conductive strip, a second conductive strip, and a conductive link electrically interconnecting said first conductive strip and said second conductive strip;
- and
- adding capacitance to said conductive link;
- and
- sizing said capacitance to optimize a frequency response characteristic of a conductive path comprising said first conductive strip, said second conductive strip, and said conductive link,
- wherein said capacitance comprises a pad embedded within said substrate between said first conductive strip and said second conductive strip, and
- wherein said pad surrounds said conductive link.
4 more elements
A method of making a wiring substrate, said method comprising:
- providing a substrate comprising a first conductive strip, a second conductive strip, and a conductive link electrically interconnecting said first conductive strip and said second conductive strip;
- adding capacitance to said conductive link;
- and
- sizing said capacitance to optimize a frequency response characteristic of a conductive path comprising said first conductive strip, said second conductive strip, and said conductive link,
- wherein said added capacitance comprises a pad embedded within said substrate between said first conductive strip and said second conductive strip, and
- wherein said pad is disposed substantially midway between said first conductive strip and said second conductive strip.
3 more elements
Dependencies are inferred from the claim text.