Wiring board
AssigneeKYOCERA Corporation
InventorHidetoshi Yugawa
Life of this patent
Estimating the term…
Abstract
A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via conductor is located on the inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on the upper surface of the first base layer and containing the same metal as the via conductor. An alloy layer containing tin and nichrome is located between the first via land and the first base layer.
Claims12
A wiring board, comprising:
- a first insulating layer and a second insulating layer;
- a first wiring conductor layer located between the first insulating layer and the second insulating layer and comprising a first via land;
- a second wiring conductor layer located on the second insulating layer and comprising a second via land;
- a via hole penetrating from an upper surface to a lower surface of the second insulating layer;
- and
- a via conductor located in the via hole and electrically connecting the first via land and the second via land,
- wherein
- the via conductor is located on an inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on an upper surface of the first base layer and containing the same metal as a metal forming the via conductor, and
- an alloy layer containing the same metal as a metal forming the first wiring conductor layer, tin, and nichrome is located between the first via land and the first base layer.
A method of manufacturing a wiring board,
- the wiring board comprising:
- a first insulating layer and a second insulating layer;
- a first wiring conductor layer located between the first insulating layer and the second insulating layer and comprising a first via land;
- a second wiring conductor layer located on the second insulating layer and comprising a second via land;
- a via hole penetrating from an upper surface to a lower surface of the second insulating layer;
- and
- a via conductor located in the via hole and electrically connecting the first via land and the second via land,
- wherein
- the via conductor is located on an inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on an upper surface of the first base layer and containing the same metal as a metal forming the via conductor, and
- an alloy layer containing the same metal as a metal forming the first wiring conductor layer, tin, and nichrome is located between the first via land and the first base layer,
- the method comprising:
- layering the second insulating layer via a metal layer containing tin and a layer containing a coupling agent, on the first wiring conductor layer located on the first insulating layer and comprising the first via land;
- forming the via hole in the second insulating layer, the via hole penetrating from the upper surface to the lower surface of the second insulating layer;
- forming, by sputtering, the first base layer formed of nichrome on the inner surface of the via hole and an upper surface of the first via land;
- forming, by sputtering, the second base layer on the upper surface of the first base layer;
- and
- forming the via conductor in the via hole.
Dependencies are inferred from the claim text.