Filter structures for integrated circuit interfaces

A method for optimizing a characteristic of a frequency response of an interconnect system interconnecting a driver on a first integrated circuit (IC) to a receiver on a second IC, wherein the interconnect system comprises a printed circuit board (PCB) trace, a first bond pad implemented on said first IC and connected to said driver, a first conductor linking said first bond pad to said PCB trace, a second bond pad implemented on said second IC and connected to said receiver, and a second conductor linking said second bond pad to said PCB trace, the method comprising the steps of

• attaching a first capacitive element to said PCB trace near a first point of contact between said first conductor and said PCB trace;
• and
• attaching said second capacitive element to said PCB trace near a second point of contact between said second conductor and said PCB trace,
• wherein capacitances of said first and second capacitive elements are sized to substantially optimize said frequency response characteristic.

An interconnect system for conveying a signal between and internal node of an integrated circuit and external node, the interconnect system comprising:

• a bond pad connected to said internal node;
• a PCB trace connected to said external node;
• a conductive path linking said bond pad to said PCB trace;
• and
• at least one capacitive element connected to said PCB trace,
• wherein said integrated circuit provides first shunt capacitance and first series resistance at said bond pad,
• wherein said conductive path provides first series inductance between said bond pad and said PCB trace;
• wherein said PCB trace has an inherent first shunt capacitance;
• wherein said at least one capacitive element adds second shunt capacitance to said trace;
• wherein said bond pad, said conductive path, said PCB trace, and said capacitive element form a filter for conducting said signal between said bond pad and said PCB trace, and
• wherein said second shunt resistance and first series inductance are sized in relation to said second series inductance, said first shunt capacitance and said load resistance to substantially optimize a frequency response characteristic of said filter.

An interconnect system for interconnecting a node of an integrated circuit to a printed circuit board (PCB) trace, the interconnect system comprising:

• a bond pad connected to said node;
• a conductor having inductance linking said bond pad to said PCB trace;
• and
• a capacitive element having capacitance connected to said PCB trace,
• wherein the capacitance of said capacitive element and the inductance of said conductor are adjusted to substantially optimize a frequency response characteristic of said interconnect system,
• wherein said capacitive element comprises a via connected to said PCB trace.

An interconnect system for interconnecting a first circuit implemented in a first integrated circuit (IC) and having output resistance and output capacitance to a second circuit implemented in a second IC and having input resistance and input capacitance, the interconnect system comprising:

• a printed circuit board (PCB) trace having a characteristic impedance,
• a first bond pad implemented on said first IC and connected to said first circuit,
• a first conductor linking said first bond pad to said PCB trace,
• a second bond pad implemented on said second IC and connected to said second circuit,
• a second conductor linking said second bond pad to said PCB trace,
• a first capacitor attached to said PCB trace, and
• a second capacitor element attached to said PCB trace,
• wherein capacitances of said first and second capacitors and inductances of said first and second conductors are sized relative to said output and input resistances, to said first and second capacitances, to said characteristic impedance, and to said input and output capacitances so as to substantially optimize a characteristic of a frequency response of said interconnect system.