Vertical device embedded printed circuit boards with doped diamond substrate and methods of manufacturing the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsYohei Iwahashi, Feng Zhou, Tianzhu Fan, Shailesh N. Joshi, Ercan Mehmet Dede
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a cold plate and a diamond-based core layer bonded to the cold plate. The diamond-based core layer includes a diamond substrate with a conductive doped cave and a bare die disposed in and bonded to the conductive doped cave. Also, a circuit board layer with a conductive pattern is bonded to the diamond-based core layer and conductive through vias extend through the circuit board layer and are in direct contact with the bare die and the conductive doped cave.
Claims20
A printed circuit board comprising:
- a cold plate;
- a diamond-based core layer bonded to the cold plate, the diamond-based core layer comprising a diamond substrate with a conductive doped cave, and a bare die disposed in and bonded to the conductive doped cave;
- a circuit board layer with a conductive pattern bonded to the diamond-based core layer;
- and
- conductive through vias extending through the circuit board layer and in direct contact with the bare die and the conductive doped cave.
A method comprising:
- forming a cave in a diamond substrate;
- conductive doping the cave and forming a conductive doped cave;
- bonding a vertical power device within the conductive doped cave and forming a diamond-based core layer;
- bonding the diamond-based core layer to a cold plate;
- bonding a circuit board layer with a predefined conductive pattern to the diamond-based core layer;
- and
- forming conductive through vias in the circuit board layer such that at least one of the conductive through vias is in direct contact with the vertical power device and at least one of the conductive through vias is in direct contact with the conductive doped cave.
Dependencies are inferred from the claim text.