Electronic element mounting substrate, electronic device, and electronic module

An electronic element mounting substrate comprising:

• a substrate comprising a first layer, a second layer located on a lower surface of the first layer, and a third layer located on a lower surface of the second layer, and on which an electronic element is to be mounted;
• a via conductor passing through from the first layer to the third layer in a vertical direction;
• a first electrical conductor layer located between the first layer and the second layer and connected to the via conductor in a plan perspective;
• and
• a second electrical conductor layer located between the second layer and the third layer and connected to the via conductor in a plan perspective, wherein
• the first electrical conductor layer comprises, in a plan perspective, a first land portion surrounding the via conductor and connected to the via conductor, a first clearance portion surrounding the first land portion, and a first peripheral portion surrounding the first clearance portion and electrically insulated from the first land portion with the first clearance portion interposed between the first land portion and the first peripheral portion,
• the second electrical conductor layer comprises, in a plan perspective, a second land portion surrounding the via conductor and connected to the via conductor, a second clearance portion surrounding the second land portion, and a second peripheral portion surrounding the second clearance portion and electrically insulated from the second land portion with the second clearance portion interposed between the second land portion and the second peripheral portion,
• the first land portion comprises, in a plan perspective, a first portion overlapping the second land portion,
• the first clearance portion comprises, in a plan perspective, a second portion not overlapping the second clearance portion, and
• the first peripheral portion and the second peripheral portion each comprise, in a vertical cross-sectional view, an end portion that becomes thinner as a distance from the via conductor increases,
• wherein the entire second clearance portion overlaps the first peripheral portion in a plan perspective.

An electronic element mounting substrate comprising:

• a substrate comprising a first layer, a second layer located on a lower surface of the first layer, and a third layer located on a lower surface of the second layer, and on which an electronic element is to be mounted;
• a via conductor passing through from the first layer to the third layer in a vertical direction;
• a first electrical conductor layer located between the first layer and the second layer and connected to the via conductor in a plan perspective;
• and
• a second electrical conductor layer located between the second layer and the third layer and connected to the via conductor in a plan perspective, wherein
• the first electrical conductor layer comprises, in a plan perspective, a first land portion surrounding the via conductor and connected to the via conductor, a first clearance portion surrounding the first land portion, and a first peripheral portion surrounding the first clearance portion and electrically insulated from the first land portion with the first clearance portion interposed between the first land portion and the first peripheral portion,
• the second electrical conductor layer comprises, in a plan perspective, a second land portion surrounding the via conductor and connected to the via conductor, a second clearance portion surrounding the second land portion, and a second peripheral portion surrounding the second clearance portion and electrically insulated from the second land portion with the second clearance portion interposed between the second land portion and the second peripheral portion,
• the first land portion comprises, in a plan perspective, a first portion overlapping the second land portion,
• the first clearance portion comprises, in a plan perspective, a second portion not overlapping the second clearance portion, and
• the first peripheral portion and the second peripheral portion each comprise, in a vertical cross-sectional view, an end portion that becomes thinner as a distance from the via conductor increases,
• wherein the entire second clearance portion overlaps the first land portion in a plan perspective.