H05K 2201/09472
Recessed pad for surface mounting
Official title: Recessed pad for surface mounting; Recessed electrode of component
H05K2201/09472 (Recessed pad for surface mounting) appears on 644 US grants and 559 published applications in this corpus.
Search patents in H05K- Granted patents
- 644
- Published applications
- 559
- Assignees
- 255
- Inventors
- 1,215
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 9 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 11 | 0 |
| 1997 | 16 | 0 |
| 1998 | 14 | 0 |
| 1999 | 20 | 0 |
| 2000 | 27 | 0 |
| 2001 | 30 | 18 |
| 2002 | 40 | 36 |
| 2003 | 34 | 31 |
| 2004 | 26 | 38 |
| 2005 | 25 | 25 |
| 2006 | 28 | 41 |
| 2007 | 26 | 31 |
| 2008 | 25 | 44 |
| 2009 | 16 | 25 |
| 2010 | 25 | 33 |
| 2011 | 23 | 19 |
| 2012 | 22 | 13 |
| 2013 | 16 | 14 |
| 2014 | 18 | 21 |
| 2015 | 18 | 18 |
| 2016 | 14 | 12 |
| 2017 | 19 | 23 |
| 2018 | 12 | 11 |
| 2019 | 17 | 11 |
| 2020 | 12 | 14 |
| 2021 | 9 | 7 |
| 2022 | 13 | 13 |
| 2023 | 3 | 16 |
| 2024 | 13 | 21 |
| 2025 | 13 | 12 |
| 2026 | 6 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof1 Sep 2026US 12,727,078 B2Samsung Electro-Mechanics Co., Ltd.
- Wearable electronic device including biometric sensor and wireless charging module30 Jun 2026US 12,667,309 B2Samsung Electronics Co., Ltd.
- Wiring board21 Apr 2026US 12,610,465 B2Shinko Electric Industries Co., Ltd.
- Semiconductor device assembly substrates with tunneled interconnects, and methods for making the same17 Mar 2026US 12,582,014 B2Micron Technology, Inc.
- Semiconductor package using flip-chip technology17 Feb 2026US 12,557,215 B2Mediatek Inc.
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Circuit board, and semiconductor package comprising same20 Aug 2026US 2026/0247530 A1LG Innotek Co., Ltd.
- Electronic device20 Aug 2026US 2026/0247531 A1InnoCare Optoelectronics Corporation
- Multilayer wiring substrate13 Aug 2026US 2026/0239530 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000
- Semiconductor interconnect having laser machined contacts223US 6,294,837 B1Micron Technology, Inc. · 2001