Semiconductor device assembly substrates with tunneled interconnects, and methods for making the same
AssigneeMicron Technology, Inc.
InventorsYun Ting Hsu, Chong Leong Gan, Min Hua Chung, Yung Sheng Zou
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly is provided. The assembly includes a package substrate which has a tunneled interconnect structure. The tunneled interconnect structure has a solder-wettable surface, an interior cavity, and at least one microvia extending from the surface to the cavity. The assembly further includes a semiconductor device disposed over the substrate and a solder joint coupling the device and the substrate. The joint comprises the solder between the semiconductor device and the interconnect structure, which includes the solder on the surface, the solder in the microvia, and the solder within the interior cavity.
Claims12
A semiconductor device assembly, comprising:
- a package substrate including a tunneled interconnect structure, the tunneled interconnect structure having:
- a solder-wettable surface, and
- a concave surface extending below and overlapped by the solder-wettable surface,
- wherein the solder-wettable surface includes at least one microvia defined by opposing side walls extending from the solder-wettable surface toward the concave surface;
- a semiconductor device disposed over the package substrate;
- and
- a solder joint coupling the semiconductor device and the package substrate, the solder joint including:
- a first region of solder between the semiconductor device and the solder-wettable surface of the tunneled interconnect structure, wherein the first region of solder extends above the solder-wettable surface,
- a second region of solder under the first region of solder and disposed in the at least one microvia, the second region directly contacting the opposing sidewalls, and
- a third region of solder under the second region of solder and contacting a lowest portion of the concave surface.
A substrate, comprising:
- a body;
- a tunneled interconnect structure directly contacting a top portion of the body, the tunneled interconnect structure including:
- a solder-wettable surface,
- a concave surface extending below and overlapped by the solder-wettable surface, and
- at least one microvia defined by opposing side walls extending from the solder-wettable surface toward the concave surface, wherein the at least one microvia and the interior cavity define a continuous space configured to retain a remainder of the solder,
- wherein the tunneled interconnect structure is configured to receive solder having (1) a first region coupling the tunneled interconnect to an external device, (2) a second region under the first region and contacting the opposing sidewalls, and (3) a third region under the second region and contacting a lowest portion of the concave surface.
Dependencies are inferred from the claim text.