Circuit board and manufacturing method thereof

A circuit board comprising:

• an insulation layer having a first surface and a second surface facing each other;
• a first pad layer including a first connection pad and a first conductive layer stacked on the first connection pad, a portion of the first pad layer being buried in the insulation layer, and another portion of the first pad layer protruding from the first surface of the insulation layer;
• a second conductive layer disposed on the first pad layer and the first conductive layer;
• and a solder resist layer disposed on the insulation layer such that the solder resist layer is spaced apart from the first conductive layer, wherein the first pad layer is disposed in a bond finger region, wherein, in a thickness direction of the insulating layer, a central portion of a lower surface of the first connection pad directly contacts the insulation layer, wherein the insulation layer includes a plurality of insulation layers, and the plurality of insulation layers include a plurality of circuit layers thereon, wherein the solder resist layer is disposed adjacent to the bond finger region and on at least one circuit layer among the plurality of circuit layers, wherein an upper surface of the insulation layer disposed in the bond finger region is lower than an upper surface of the insulation layer adjacent to the bond finger region, and wherein the second conductive layer covers a lateral surface of the first conductive layer protruding from the first surface.