H05K 2201/0939
Curved pads
Official title: Curved pads, e.g. semi-circular or elliptical pads or lands
H05K2201/0939 (Curved pads) appears on 119 US grants and 144 published applications in this corpus.
Search patents in H05K- Granted patents
- 119
- Published applications
- 144
- Assignees
- 112
- Inventors
- 413
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 4 |
| 2012 | 2 | 1 |
| 2013 | 3 | 4 |
| 2014 | 1 | 2 |
| 2015 | 3 | 8 |
| 2016 | 3 | 6 |
| 2017 | 8 | 4 |
| 2018 | 5 | 6 |
| 2019 | 7 | 4 |
| 2020 | 9 | 14 |
| 2021 | 8 | 7 |
| 2022 | 9 | 14 |
| 2023 | 7 | 12 |
| 2024 | 8 | 20 |
| 2025 | 13 | 19 |
| 2026 | 12 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Circuit board4 Aug 2026US 12,702,024 B2LG Innotek Co., Ltd.
- Semiconductor storage device21 Jul 2026US 12,690,130 B2Kioxia Corporation
- Bond pad connector for securing an electronic component thereon19 May 2026US 12,635,074 B2Jabil Inc.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Circuit board, and semiconductor package comprising same16 Jul 2026US 2026/0206144 A1LG Innotek Co., Ltd.
- Filling cracks on a substrate via9 Jul 2026US 2026/0197942 A1Micron Technology, Inc.
Most cited
By later US patents
- Ultra-small LED electrode assembly and method for manufacturing same114US 9,773,761 B2Psi Co., Ltd. · 2017
- Electronic structures having a joining geometry providing reduced capacitive loading90US 5,471,090 AInternational Business Machines Corporation · 1995
- Reflow ball grid array assembly81US 5,859,474 ALSI Logic Corporation · 1999
- Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch81US 6,218,630 B1Fuji Photo Film Co., Ltd. · 2001
- Self aligning electrical component62US 5,898,574 A1999