Circuit board
AssigneeLG Innotek Co., Ltd.
InventorsSe Woong Na, Sang Il Kim, Kee Han Lee
Life of this patent
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Abstract
A circuit board including a first insulating layer; a first circuit pattern layer disposed on the first insulating layer and including a first pad; a second circuit pattern layer disposed on a lower surface of the first insulating layer; and a first electrode part disposed in the first insulating layer and vertically overlapping the first pad. A lower surface of the first electrode part is located higher than an upper surface of the second circuit pattern layer, and the first pad includes a first concave portion formed in a region that vertically overlaps the first electrode part.
Claims18
A circuit board, comprising:
- a first insulating layer;
- a first circuit pattern layer disposed on the first insulating layer and including a first pad;
- a second circuit pattern layer disposed on a lower surface of the first insulating layer;
- and
- a first electrode part disposed in the first insulating layer and vertically overlapping the first pad, wherein a lower surface of the first electrode part is located higher than an upper surface of the second circuit pattern layer, wherein the first pad includes a first concave portion formed in an upper surface of the first pad in a region that vertically overlaps the first electrode part, wherein an upper surface of the first electrode part is in direct contact with a lower surface of the first pad, and wherein the lower surface of the first electrode part is spaced apart in a vertical direction from the upper surface of the second circuit pattern layer.
A semiconductor package, comprising:
- a first insulating layer;
- a first circuit pattern layer including a first pad and a second pad disposed on the first insulating layer;
- a second circuit pattern layer disposed on a lower surface of the first insulating layer;
- a first electrode part disposed in the first insulating layer and vertically overlapping the first pad;
- a second electrode part disposed in the first insulating layer and vertically overlapping the second pad;
- a first connection part disposed on the first pad and the second pad;
- a chip mounted on the first connection part;
- and
- a molding layer for molding the chip, wherein the first electrode part has a thickness less than a thickness of the first insulating layer, wherein the second electrode part has a thickness corresponding to the thickness of the first insulating layer, wherein the first pad includes a first concave portion formed in an upper surface of the first pad in a region that vertically overlaps the first electrode part, wherein the second pad includes a second concave portion formed in a region that vertically overlaps the second electrode part, wherein an upper surface of the first electrode part is in direct contact with a lower surface of the first pad, and wherein the lower surface of the first electrode part is spaced apart in a vertical direction from the upper surface of the second circuit pattern layer.
Dependencies are inferred from the claim text.