Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
AssigneeFuji Photo Film Co., Ltd.
InventorKotaro Takigami
Life of this patent
Estimating the term…
Loading patent…
AssigneeFuji Photo Film Co., Ltd.
InventorKotaro Takigami
Estimating the term…
A printed circuit board includes a plurality of lands thereon. The size D2 of the outer land 3 in the direction along the outside array is less than the size D1 of the inner land 1 in the direction along the inside array. Therefore, it is possible to pass the pattern 4 with enough clearance against the outer land 3. The outer lands 3 are formed with an oval, elliptical or oblong shape. Namely, the size D3 of the outer land 3 in the direction perpendicular to the direction of the outside array is greater than the size D2. Then, it is possible to ensure a sufficient reliability of a soldered part. Preferably, the connected area 5 between the inner land 1 and the pattern 4 and the connected area 7 between the outer land 3 and the pattern 6 are formed as a shape of a tear-drop. Then, the patterns 4, 6 cannot be easily cut by a thermal stock or a heat cycle. The solder resist 8 is coated, around the outer land 3, from an outer area to an inner area of the outer land 3, except for the central area 3A. The resist 8 is further coated, around the inner land 1, from an outer area to an inner area of the inner land 1, except for the central area 1A. Then, each area 5, 7 is reinforced by the resist 8. Further, since a clearance between exposed areas 1A and a clearance between exposed areas 3A are widened, a bridge of solder does not easily occur.
A printed circuit board, for mounting at least one Chip Size Package with at least one array of at least one ball-type terminal for electric connection arranged inside and outside of one another, comprising:
A printed circuit board, for mounting parts with at least one array of at least one ball-type terminal for electric connection arranged relatively inside and outside of one another, comprising:
A printed circuit board, for mounting parts with at least one array of at least one ball-type terminal for electric connection arranged relatively inside and outside of one another, comprising:
A printed circuit board for mounting at least one Chip Size Package having at least one first inner electric connection land surrounded by at least one first outer electric connection land arranged thereon, comprising:
Dependencies are inferred from the claim text.