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US 2026/0206144 A1Published application
Circuit board, and semiconductor package comprising same
AssigneeLG Innotek Co., Ltd.
InventorsWon Suk JUNG, Bung Suek OH
Life of this patent
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Abstract
A circuit board according to an embodiment includes a first insulating layer including a cavity; a connection member disposed in the cavity; and a second insulating layer disposed on the connection member and including a material different from a material of the first insulating layer, and wherein a width of the second insulating layer is larger than a width of the connection member.
Claims20
A circuit board comprising:
- a first insulating layer including a cavity;
- a connection member disposed in the cavity;
- and
- a second insulating layer disposed on the connection member and including a material different from a material of the first insulating layer,
- wherein a width of the second insulating layer is larger than a width of the connection member.
2 more elements
Dependencies are inferred from the claim text.