H05K 2201/09381
Shape of non-curved single flat metallic pad, land or exposed part thereof
Official title: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
H05K2201/09381 (Shape of non-curved single flat metallic pad, land or exposed part thereof) appears on 547 US grants and 539 published applications in this corpus.
Search patents in H05K- Granted patents
- 547
- Published applications
- 539
- Assignees
- 308
- Inventors
- 1,340
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 10 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 9 | 0 |
| 2000 | 15 | 0 |
| 2001 | 16 | 9 |
| 2002 | 19 | 19 |
| 2003 | 15 | 24 |
| 2004 | 17 | 18 |
| 2005 | 21 | 25 |
| 2006 | 24 | 21 |
| 2007 | 15 | 25 |
| 2008 | 16 | 36 |
| 2009 | 11 | 44 |
| 2010 | 25 | 21 |
| 2011 | 23 | 22 |
| 2012 | 28 | 14 |
| 2013 | 12 | 16 |
| 2014 | 14 | 19 |
| 2015 | 20 | 25 |
| 2016 | 11 | 14 |
| 2017 | 15 | 18 |
| 2018 | 28 | 14 |
| 2019 | 15 | 25 |
| 2020 | 17 | 16 |
| 2021 | 26 | 19 |
| 2022 | 14 | 22 |
| 2023 | 12 | 21 |
| 2024 | 17 | 21 |
| 2025 | 13 | 13 |
| 2026 | 17 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board11 Aug 2026US 12,707,559 B2LG Innotek Co., Ltd.
- Printed circuit board, maintenance method therefor, and display apparatus28 Jul 2026US 12,696,388 B2Boe Technology Group Co., Ltd.
- Connecting arrangement30 Jun 2026US 12,672,234 B2Robert Bosch GmbH
- Bond pad connector for securing an electronic component thereon19 May 2026US 12,635,074 B2Jabil Inc.
- Dimple on circuit board for providing standoff between circuit board and circuit package12 May 2026US 12,628,270 B2Dell Products L. P.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Multi-layer board17 Sep 2026US 2026/0282226 A1Tong Hsing Electronic Industries, Ltd.
- Methods and apparatus to enable attachment of surface mount technology (smt) components of different sizes to an underlying substrate13 Aug 2026US 2026/0239532 A1Intel Corporation
- Wiring board, electronic component mounting substrate including wiring board, and electronic module6 Aug 2026US 2026/0231323 A1KYOCERA Corporation
- Circuit board6 Aug 2026US 2026/0231325 A1
Most cited
By later US patents
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Solder ball land metal structure of ball grid semiconductor package176US 5,872,399 AAmkor Technology, Inc. · 1999
- Method of controlling solder ball size of BGA IC components152US 5,519,580 AIntel Corporation · 1996
- Surface mount multilayer capacitor138US 6,243,253 B1AVX Corporation · 2001
- Making solder ball mounting pads on substrates132US 6,201,305 B1Amkor Technology, Inc. · 2001