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US 12,707,559 B2Granted
Circuit board
AssigneeLG Innotek Co., Ltd.
InventorsMyung Jae Kwon, Dong Sun Kim, Sang Hyuck Nam, Sung Wuk Ryu, Chang Woo Yoo, Ju Hyun Lee
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Abstract
A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.
Claims16
A circuit board comprising:
- a first insulating layer;
- a first circuit pattern layer disposed on the first insulating layer;
- and
- a second insulating layer disposed on the first insulating layer and the first circuit pattern layer,
- wherein the first insulating layer includes a first opening passing through at least a part of the first insulating layer from an upper surface of the first insulating layer toward a lower surface of the first insulating layer,
- wherein the first circuit pattern layer includes a first electrode having a second opening overlapping the first opening in a vertical direction,
- wherein the second opening passes through upper and lower surfaces of the first electrode,
- wherein the second insulating layer is provided to fill the first opening of the first insulating layer and the second opening of the first electrode, and
- wherein a width of the first opening in a region closest to the second opening is the same as a width of the second opening in a region closest to the first opening.
6 more elements
Dependencies are inferred from the claim text.