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US 12,628,270 B2Granted
Dimple on circuit board for providing standoff between circuit board and circuit package
AssigneeDell Products L.P.
InventorsEarl Boone, James L. Petivan, Wallace H. Ables, Steven R. Ethridge
Life of this patent
Estimating the term…
Abstract
An information handling resource may include a circuit board comprising an electrically-conductive pad and a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board.
Claims21
An information handling resource comprising:
- a circuit board comprising an electrically-conductive pad;
- and
- a dimple formed on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board, wherein:
- an interior surface defining the depression is curved and a portion of the depression is below the surface of the circuit board;
- an exterior surface of the dimple is concave;
- and
- a height of the dimple is approximately equal to a distance between the surface of the circuit board and a surface of a circuit package configured to be electrically and mechanically coupled to the circuit board.
4 more elements
An information handling system comprising:
- a processor;
- and
- an information handling resource comprising:
- a circuit board comprising an electrically-conductive pad;
- and
- a dimple formed on a surface of the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board, wherein:
- an interior surface defining the depression is curved and a portion of the depression is below the surface of the circuit board;
- an exterior surface of the dimple above the surface of the circuit board is concave;
- and
- a height of the dimple is approximately equal to a distance between the surface of the circuit board and a surface of a circuit package configured to be electrically and mechanically coupled to the circuit board.
7 more elements
A method comprising:
- forming a circuit board with an electrically-conductive pad;
- and
- forming a dimple on the circuit board, the dimple having a depression surrounded by a raised perimeter raised above a surface of the circuit board, wherein;
- an interior surface defining the depression is curved and a portion of the depression is below the surface of the circuit board;
- an exterior surface of the dimple above the surface of the circuit board is concave;
- and
- a height of the dimple is approximately equal to a distance between the surface of the circuit board and a surface of a circuit package configured to be electrically and mechanically coupled to the circuit board.
4 more elements
Dependencies are inferred from the claim text.