Connecting arrangement

A method for forming a connecting arrangement, the connecting arrangement including a first and a second connecting partner, the method comprising the following steps:

• a) forming a solder connection surface on each of the connecting partners, wherein the solder connection surfaces can be wetted by a solder material in a molten state, wherein the solder connection surfaces are each formed such that, in an arrangement of the two connecting partners according to step b), at least one definable projection area with in each case mutually overlapping solder connection surface parts is defined in a perpendicular projection of both solder connection surfaces onto one another, wherein the at least one definable projection area has at least one peripherally closed edge with at least one contained first cohesive projection sub-area, which is directly adjoined by at least one or more further projection sub-areas;
• b) arranging the two connecting partners one above the other with the solder connection surfaces facing one another oriented parallel to one another, and at a distance from one another, wherein the solder material is arranged between the solder connection surfaces, wherein a sufficient solder quantity is selected for formation of a solidified solder layer with a defined edge and layer thickness;
• c) melting the solder material and wetting the solder connection surface parts, wherein all solder connection surface parts within the at least one first cohesive projection sub-area are wetted first and, depending on excess solder material, remaining solder connection surface portions within the at least one or more further projection sub-areas are only subsequently wetted at least regionally;
• and d) cooling the solder material, wherein, in a region of the at least one first cohesive projection sub-area, the solder layer is formed with an edge corresponding to the at least one first cohesive projection sub-area, and with the defined layer thickness, wherein the excess solder material is buffered in a region of the at least one or more further projection sub-areas.