Circuit board and manufacturing method thereof

A circuit board, comprising:

• a first insulation layer;
• a circuit wire positioned on the first insulation layer;
• a second insulation layer covering at least a portion of the circuit wire and overlapping at least a portion of the circuit wire, and having a via hole including a first side wall and a second side wall having different tilt angles, the via hole extending in a thickness direction of the first insulation layer;
• a first seed layer covering the first side wall and the second side wall of the via hole;
• a second seed layer positioned in the via hole and covering the first seed layer;
• a third seed layer positioned on an upper surface of the second insulation layer and including the same material as the second seed layer;
• a first conductive layer positioned on the second seed layer;
• and
• a second conductive layer positioned on the third seed layer,
• wherein the first conductive layer is in contact with a portion of the first seed layer.

A circuit board, comprising:

• a first insulation layer;
• a circuit wire positioned on the first insulation layer;
• a second insulation layer having a via hole covering at least a portion of the circuit wire and overlapping at least a portion of the circuit wire;
• a first seed layer covering a side wall of the via hole;
• a second seed layer positioned in the via hole and covering the first seed layer;
• a third seed layer positioned on an upper surface of the second insulation layer and including the same material as the second seed layer;
• a first conductive layer positioned on the second seed layer;
• and
• a second conductive layer positioned on the third seed layer,
• wherein a thickness of the second seed layer decreases in a direction from the upper surface of the second insulation layer to a bottom of the via hole.