H05K 2201/09654
Covering at least two types of conductors provided for in h05k2201/09218 -
Official title: covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
H05K2201/09654 (Covering at least two types of conductors provided for in h05k2201/09218 -) appears on 6,830 US grants and 6,945 published applications in this corpus.
Search patents in H05K- Granted patents
- 6,830
- Published applications
- 6,945
- Assignees
- 1,901
- Inventors
- 13,190
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 12 | 0 |
| 1978 | 10 | 0 |
| 1979 | 7 | 0 |
| 1980 | 4 | 0 |
| 1981 | 12 | 0 |
| 1982 | 15 | 0 |
| 1983 | 12 | 0 |
| 1984 | 14 | 0 |
| 1985 | 28 | 0 |
| 1986 | 22 | 0 |
| 1987 | 29 | 0 |
| 1988 | 18 | 0 |
| 1989 | 41 | 0 |
| 1990 | 39 | 0 |
| 1991 | 55 | 0 |
| 1992 | 43 | 0 |
| 1993 | 50 | 0 |
| 1994 | 69 | 0 |
| 1995 | 86 | 0 |
| 1996 | 72 | 0 |
| 1997 | 68 | 0 |
| 1998 | 113 | 0 |
| 1999 | 107 | 0 |
| 2000 | 118 | 0 |
| 2001 | 164 | 75 |
| 2002 | 205 | 180 |
| 2003 | 206 | 253 |
| 2004 | 218 | 294 |
| 2005 | 181 | 349 |
| 2006 | 239 | 386 |
| 2007 | 230 | 429 |
| 2008 | 272 | 456 |
| 2009 | 237 | 501 |
| 2010 | 327 | 393 |
| 2011 | 316 | 299 |
| 2012 | 370 | 262 |
| 2013 | 255 | 240 |
| 2014 | 214 | 331 |
| 2015 | 246 | 290 |
| 2016 | 252 | 229 |
| 2017 | 268 | 217 |
| 2018 | 204 | 191 |
| 2019 | 227 | 194 |
| 2020 | 191 | 248 |
| 2021 | 180 | 237 |
| 2022 | 191 | 206 |
| 2023 | 183 | 226 |
| 2024 | 168 | 165 |
| 2025 | 157 | 113 |
| 2026 | 74 | 181 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09781Dummy conductors, i.e. not used for normal transport of currentIndexing code1,514
- H05K 2201/09727Varying width along a single conductorIndexing code742
- H05K 2201/0969Apertured conductorsIndexing code710
- H05K 2201/09672Superposed layout, i.e. in different planesIndexing code651
- H05K 2201/09663Divided layout, i.e. conductors divided in two or more partsIndexing code545
- H05K 2201/09809Coaxial layoutIndexing code519
- H05K 2201/09745Recess in conductorIndexing code498
- H05K 2201/0979Redundant conductors or connections, i.e. more than one current path between twoIndexing code479
All 17 subgroupsShow fewer
- H05K 2201/09681Mesh conductorsIndexing code464
- H05K 2201/09736Varying thickness of a single conductorIndexing code425
- H05K 2201/09709Staggered pads, lands or terminalsIndexing code405
- H05K 2201/09718Clearance holesIndexing code308
- H05K 2201/097Alternating conductorsIndexing code254
- H05K 2201/098Special shape of the cross-section of conductorsIndexing code246
- H05K 2201/09763Printed component having superposed conductors, but integrated in one circuit layerIndexing code176
- H05K 2201/09754Connector integrally incorporated in the printed circuit board [pcb] or in housingIndexing code135
- H05K 2201/09772Conductors directly under a component but not electrically connected to the componentIndexing code125
Recent patents
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Waveguide interface for coupling a waveguide to a microwave conductor on a PCB and including a backshort dielectric being the same as a dielectric of the PCB22 Sep 2026US 12,744,296 B2Telefonaktiebolaget LM Ericsson (publ)
- Core resonance suppression in signal integrity optimized package15 Sep 2026US 12,739,967 B2Avago Technologies International Sales Pte. Limited
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Wiring board and electronic device17 Sep 2026US 2026/0282206 A1KYOCERA Corporation
- Base member, electronic device, and structure17 Sep 2026US 2026/0282217 A1Canon Kabushiki Kaisha
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads10 Sep 2026US 2026/0271754 A1Advanced Semiconductor Engineering, Inc.
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Wiring board, module, and image display apparatus27 Aug 2026US 2026/0254102 A1Dai Nippon Printing Co.Ltd.
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Thermally protected LED array337US 5,785,418 A1998
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- High density chip carrier with integrated passive devices303US 6,962,872 B2International Business Machines Corporation · 2005