H05K 2201/09809
Coaxial layout
H05K2201/09809 (Coaxial layout) appears on 519 US grants and 504 published applications in this corpus.
Search patents in H05K- Granted patents
- 519
- Published applications
- 504
- Assignees
- 289
- Inventors
- 1,187
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 13 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 9 |
| 2002 | 21 | 24 |
| 2003 | 25 | 38 |
| 2004 | 26 | 31 |
| 2005 | 21 | 27 |
| 2006 | 23 | 43 |
| 2007 | 21 | 36 |
| 2008 | 26 | 41 |
| 2009 | 24 | 41 |
| 2010 | 28 | 35 |
| 2011 | 23 | 20 |
| 2012 | 31 | 3 |
| 2013 | 18 | 12 |
| 2014 | 5 | 7 |
| 2015 | 11 | 10 |
| 2016 | 4 | 10 |
| 2017 | 14 | 9 |
| 2018 | 12 | 7 |
| 2019 | 13 | 10 |
| 2020 | 8 | 15 |
| 2021 | 7 | 17 |
| 2022 | 21 | 19 |
| 2023 | 16 | 23 |
| 2024 | 14 | 4 |
| 2025 | 13 | 4 |
| 2026 | 2 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board, manufacturing method thereof, and electronic device24 Feb 2026US 12,563,668 B2Unimicron Technology Corp.
- Capacitor in a substrate via6 Jan 2026US 12,520,426 B2Intel Corporation
- High-frequency signal transmission device and electrical connection method for wiring board and connector30 Dec 2025US 12,512,613 B2Yamaichi Electronics Co., Ltd.
- Electronic device including wire16 Dec 2025US 12,500,970 B2Samsung Electronics Co., Ltd.
- Electronic component assembly, an antenna array system, and electronic device, and a method for manufacturing an electrical component assembly16 Dec 2025US 12,501,584 B2Telefonaktiebolaget LM Ericsson (publ)
- Printed circuit board (pcb) miniaturization by an embedded via-in-via design30 Jul 2026US 2026/0223279 A1Google Inc.
- Electronic chip packaging11 Jun 2026US 2026/0165178 A1STMicroelectronics International N. V.
- Circuit board, manufacturing method thereof, and electronic device4 Jun 2026US 2026/0156748 A1Unimicron Technology Corp.
- Electronic device including wire16 Apr 2026US 2026/0106925 A1Samsung Electronics Co., Ltd.
- High-density decoupling capacitor routing optimizing capacitance with consideration for high-yield manufacturing19 Mar 2026US 2026/0082484 A1Nokia Solutions and Networks Oy
Most cited
By later US patents
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006
- High density chip carrier with integrated passive devices303US 6,962,872 B2International Business Machines Corporation · 2005
- Coaxial waveguide microstructures and methods of formation thereof292US 7,012,489 B2Rohm and Haas Electronic Materials LLC · 2006
- Long range optical reader243US 7,055,747 B2Hand Held Products, Inc. · 2006
- Optical reader having a plurality of imaging modules219US 7,219,843 B2Hand Held Products, Inc. · 2007