Circuit board, manufacturing method thereof, and electronic device

An electronic device, comprising:

• a circuit board, comprising a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and a plurality of second conductive vias, wherein
• the first external circuit layer is disposed on the first dielectric material;
• the second external circuit layer is at least disposed on the third dielectric material;
• the second dielectric material is disposed between the first dielectric material and the third dielectric material;
• the conductive structure is at least disposed between the first dielectric material and the second dielectric material, between the second dielectric material and the third dielectric material, and between the second dielectric material and the fourth dielectric material;
• the first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path;
• and
• the second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via, wherein the second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path,
• the first conductive via comprises a first through hole, and each of the second conductive vias comprises a second through hole,
• the first conductive via further comprises a first hole filling material filling the first through hole, and each of the second conductive vias further comprises a second hole filling material filling the second through hole;
• and
• an electronic element, electrically connected to the circuit board,
• wherein the first external circuit layer and the second external circuit layer respectively cover a first upper surface and a first lower surface of the first hole filling material;
• and
• the first external circuit layer and the second external circuit layer respectively cover a second upper surface and a second lower surface of the second hole filling material.