High-density decoupling capacitor routing optimizing capacitance with consideration for high-yield manufacturing

An electronic product, comprising:

• a substrate having a top side and a bottom side;
• a first via pad having a plurality of extensions extending outwardly therefrom, disposed on the bottom side;
• a second via pad;
• a third via pad;
• a first component having a first horizontal axis, a first terminal, and a second terminal, the first component disposed on the bottom side between the second via pad and a first extension of the plurality of extensions such that the first horizontal axis forms an angle α with respect to a first via-to-via axis line between the first via pad and the second via pad, wherein α is greater than a threshold angle;
• and
• a second component having a second horizontal axis, a third terminal, and a fourth terminal, the second component disposed on the bottom side between the third via pad and a second extension of the plurality of extensions such that the second horizontal axis forms an angle β with respect to a second via-to-via axis line between the first via pad and the third via pad, wherein β is greater than the threshold angle.

A method of manufacturing an electronic product, comprising:

• providing a multi-layer printed circuit board (PCB) having a top side and a bottom side, the multi-layer PCB having a central via pad, a first via pad, a second via pad, and a third via pad, wherein the first via pad, the second via pad, and the third via pad, are each spaced apart from the central via pad, and the central via pad has a plurality of extensions extending outwardly therefrom on the bottom side;
• placing a first component having a first horizontal axis between the central via pad and the first via pad such that the first horizontal axis is angled away from a first via-to-via axis between the central via pad and the first via pad by a first amount;
• placing a second component having a second horizontal axis between the central via pad and the second via pad such that the second horizontal axis is angled away from a second via-to-via axis between the central via pad and the second via pad by a second amount;
• placing a third component having a third horizontal axis between the central via pad and the third via pad such that the third horizontal axis is angled away from a third via-to-via axis between the central via pad and the third via pad by a third amount;
• and
• performing a reflow solder operation,
• wherein a first component gap between the first component and the second component, a second component gap between the second component and the third component, and a third component gap between the third component and the first component, are each greater than a predetermined distance.