H05K 2201/09681
Mesh conductors
Official title: Mesh conductors, e.g. as a ground plane
H05K2201/09681 (Mesh conductors) appears on 464 US grants and 543 published applications in this corpus.
Search patents in H05K- Granted patents
- 464
- Published applications
- 543
- Assignees
- 273
- Inventors
- 1,112
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 9 | 5 |
| 2002 | 9 | 10 |
| 2003 | 10 | 11 |
| 2004 | 11 | 13 |
| 2005 | 11 | 14 |
| 2006 | 5 | 14 |
| 2007 | 7 | 16 |
| 2008 | 12 | 27 |
| 2009 | 12 | 32 |
| 2010 | 7 | 26 |
| 2011 | 21 | 15 |
| 2012 | 20 | 16 |
| 2013 | 15 | 21 |
| 2014 | 19 | 58 |
| 2015 | 23 | 25 |
| 2016 | 31 | 27 |
| 2017 | 27 | 32 |
| 2018 | 26 | 23 |
| 2019 | 30 | 29 |
| 2020 | 27 | 34 |
| 2021 | 17 | 24 |
| 2022 | 18 | 15 |
| 2023 | 20 | 21 |
| 2024 | 16 | 18 |
| 2025 | 14 | 10 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, module, and image display apparatus19 May 2026US 12,633,651 B2Dai Nippon Printing Co.Ltd.
- Wiring board and method for manufacturing wiring board31 Mar 2026US 12,593,395 B2Dai Nippon Printing Co.Ltd.
- Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures3 Mar 2026US 12,568,783 B2EKC Technology, Inc.
- Method for forming conductive thin wire, method for producing transparent conductor, method for producing device, and set of conductive ink and base material10 Feb 2026US 12,550,267 B2Konica Minolta, Inc.
- Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same13 Jan 2026US 12,526,920 B1The Topline Corporation
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Wiring board, module, and image display apparatus27 Aug 2026US 2026/0254102 A1Dai Nippon Printing Co.Ltd.
- Wiring board and method for manufacturing wiring board13 Aug 2026US 2026/0239527 A1Dai Nippon Printing Co.Ltd.
- Multilayer wiring substrate9 Jul 2026US 2026/0198161 A1Panasonic Intellectual Property Management Co., Ltd.
- Multilayered flexible printed circuit board and electronic device comprising same18 Jun 2026US 2026/0173252 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Multi-layer circuit substrate having orthogonal grid ground and power planes188US 6,184,477 B2KYOCERA Corporation · 2001
- Multilayer wiring structure for attaining high-speed signal propagation143US 5,633,479 AKabushiki Kaisha Toshiba · 1997
- Circuits for flexible structures92US 9,894,756 B2Kardium Inc. · 2018
- Method for fabrication of a stretchable electronic skin90US 8,332,053 B1HRL Laboratories, LLC · 2012
- Circuit board voltage plane impedance matching81US 6,150,895 ADell USA, L. P. · 2000