Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures
AssigneeEKC Technology, Inc.
InventorsXiqiang Yang, Yadong Cao, Ajay Virkar
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Abstract
A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe+3 ions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.
Claims20
A method for patterning a structure comprising a metal layer interfaced with a transparent conductive film, the method comprising:
- contacting the metal layer through a patterned mask with an etching solution comprising Fe+3 ions and nitric acid, the metal layer comprising copper, nickel, aluminum or alloys thereof, the transparent conductive film comprising conductive elements comprising silver,
- thereby etching the metal layer to expose a portion of the transparent conductive film.
Dependencies are inferred from the claim text.