A method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than a boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, wherein
- the base material has surface energy of less than 40 mN/m, and
- conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2<θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2, wherein the base material has an undercoat layer containing at least a resin containing a hydrophobic acrylic resin skeleton.