Wiring board and method for manufacturing wiring board
AssigneeDai Nippon Printing Co., Ltd.
InventorsKoichi Suzuki, Seiji Take, Daisuke Matsuura
Life of this patent
Estimating the term…
Abstract
A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W3) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W1) of the first-direction wiring line (21) in the second region (27).
Claims10
A wiring board, comprising:
- a substrate that is transparent;
- a mesh-like wiring pattern region disposed on the substrate and having wiring lines;
- and
- a feeding unit electrically connected to the wiring lines of the wiring pattern region and having a surface located on a same plane with a surface of the mesh-like wiring pattern region,
- wherein the feeding unit has through holes or non-through holes,
- wherein a pitch of the through holes or the non-through holes is 100 μm or more and 500 μm or less, and
- wherein the pitch is a length of a metal portion between the through holes adjacent to each other, or a length of a metal portion between the non-through holes adjacent to each other.
A method for manufacturing a wiring board, the method comprising:
- a step of preparing a substrate that is transparent;
- and
- a step of forming a mesh-like wiring pattern region having wiring lines and forming a feeding unit electrically connected to the wiring lines on the substrate, the wiring pattern region and the feeding unit being formed on the substrate and having a surface located on a same plane with a surface of the mesh-like wiring pattern region,
- wherein the feeding unit has through holes or non-through holes,
- wherein a pitch of the through holes or the non-through holes is 100 μm or more and 500 μm or less, and
- wherein the pitch is a length of a metal portion between the through holes adjacent to each other, or a length of a metal portion between the non-through holes adjacent to each other.
Dependencies are inferred from the claim text.