H05K 2201/09736
Varying thickness of a single conductor
Official title: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
H05K2201/09736 (Varying thickness of a single conductor) appears on 425 US grants and 445 published applications in this corpus.
Search patents in H05K- Granted patents
- 425
- Published applications
- 445
- Assignees
- 235
- Inventors
- 1,042
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
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| 1985 | 1 | 0 |
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| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 12 | 3 |
| 2002 | 9 | 5 |
| 2003 | 6 | 16 |
| 2004 | 17 | 18 |
| 2005 | 11 | 23 |
| 2006 | 9 | 27 |
| 2007 | 23 | 23 |
| 2008 | 14 | 21 |
| 2009 | 6 | 39 |
| 2010 | 19 | 32 |
| 2011 | 23 | 22 |
| 2012 | 31 | 28 |
| 2013 | 15 | 10 |
| 2014 | 26 | 19 |
| 2015 | 11 | 16 |
| 2016 | 17 | 23 |
| 2017 | 21 | 10 |
| 2018 | 11 | 17 |
| 2019 | 7 | 4 |
| 2020 | 13 | 16 |
| 2021 | 8 | 14 |
| 2022 | 12 | 17 |
| 2023 | 13 | 19 |
| 2024 | 10 | 8 |
| 2025 | 11 | 10 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Manufacturing methods for printed circuit boards142US 6,902,869 B2International Business Machines Corporation · 2005
- Printed wiring board and method for producing the same106US 6,715,204 B1Ibiden Co., Ltd. · 2004
- Array connector102US 5,071,359 ARogers Corporation · 1991
- Cavity and bump interconnection structure for electronic packages99US 5,525,065 AHughes Aircraft Company · 1996
- Process for forming solid conductive vias in substrates92US 5,454,928 AWatkins-Johnson Company · 1995