Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKyehwan Lee
Life of this patent
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Abstract
A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
Claims20
A circuit board comprising:
- an insulating layer;
- a solder resist layer disposed on the insulating layer and having first and second openings;
- first and second connection pads respectively disposed within the first and second openings on the insulating layer;
- a first conductive layer disposed on the first connection pad and protruding more than an upper surface of the solder resist layer;
- and
- a second conductive layer disposed on the second connection pad and protruding more than the upper surface of the solder resist layer,
- wherein the first conductive layer and the second conductive layer have different thicknesses, and
- each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
A circuit board comprising:
- an insulating layer;
- a solder resist layer disposed on the insulating layer and having first and second openings;
- first and second connection pads respectively disposed within the first and second openings on the insulating layer;
- a first conductive layer disposed on the first connection pad and protruding more than an upper surface of the solder resist layer;
- and
- a second conductive layer disposed on the second connection pad and protruding more than the upper surface of the solder resist layer,
- wherein the first conductive layer and the second conductive layer have different thicknesses,
- each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer, and
- the lower conductive layer is in physical contact with the solder resist layer.
Dependencies are inferred from the claim text.