Back to results
US 12,520,420 B2Granted
Wiring substrate
AssigneeIbiden Co., Ltd.
InventorsHiroki Wakamori, Ikuya Terauchi, Takahiro Yamada
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes an insulating layer, and a conductor layer including a wiring formed on the insulating layer. The wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section.
Claims20
A wiring substrate, comprising:
- an insulating layer;
- and
- a conductor layer including a wiring formed on the insulating layer,
- wherein the wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section, and the wiring in the conductor layer is formed such that a cross-sectional area perpendicular to a length direction of the wiring in the first section is substantially equal to a cross-sectional area perpendicular to the length direction of the wiring in the second section.
1 more element
A wiring substrate, comprising:
- an insulating layer;
- and
- a conductor layer including a wiring formed on the insulating layer,
- wherein the wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section, and the wiring in the conductor layer has a third section interposed between the first section and the second section such that a wiring width in the third section decreases from a first section side toward a second section side and that a wiring thickness in the third section increases from the first section side toward the second section side.
1 more element
A wiring substrate, comprising:
- an insulating layer;
- and
- a conductor layer including a wiring formed on the insulating layer,
- wherein the wiring in the conductor layer has a first section and a second section formed such that a wiring width in the second section is smaller than a wiring width in the first section and that a wiring thickness in the second section is larger than a wiring thickness in the first section, and the wiring in the conductor layer includes a metal film layer and an electrolytic plating layer formed on the metal film layer and is formed such that a thickness of the electrolytic plating layer of the wiring in the second section is greater than a thickness of the electrolytic plating layer of the wiring in the first section.
1 more element
Dependencies are inferred from the claim text.