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US 12,557,214 B2Granted
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsKenta Fukushima, Hayato Takakura, Naoki Shibata, Ryosuke Sasaoka
Life of this patent
Estimating the term…
Abstract
A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.
Claims6
A wiring circuit board comprising:
- an insulating layer;
- a conductive pattern disposed on one side of the insulating layer in a thickness direction and having a first terminal, a second terminal, a third terminal, a fourth terminal, a first wiring connecting the first terminal to the third terminal, and a second wiring connecting the second terminal to the fourth terminal and disposed spaced from the first wiring;
- and
- a metal support layer disposed on the other side of the insulating layer in the thickness direction and having a first terminal support portion supporting the first terminal and the second terminal, a second terminal support portion supporting the third terminal and the fourth terminal, a first wiring support portion supporting the first wiring, and a second wiring support portion supporting the second wiring and disposed spaced from the first wiring support portion, wherein
- a thickness of each of the first wiring support portion and the second wiring support portion is thinner than the thickness of the first terminal support portion, and also thinner than the thickness of the second terminal support portion.
2 more elements
A wiring circuit board comprising:
- an insulating layer;
- a conductive pattern disposed on one side of the insulating layer in a thickness direction and having a first terminal, a second terminal, a first wiring connected to the first terminal, and a second wiring connected to the second terminal and disposed spaced from the first wiring;
- and
- a metal support layer disposed on the other side of the insulating layer in the thickness direction and having a terminal support portion supporting the first terminal and the second terminal, a first wiring support portion supporting the first wiring, and a second wiring support portion supporting the second wiring and disposed spaced from the first wiring support portion,
- wherein a thickness of each of the first wiring support portion and the second wiring support portion is thinner than the thickness of the terminal support portion;
- and
- wherein the metal support layer has
- a first metal support layer and
- a second metal support layer disposed between the first metal support layer and the insulating layer in the thickness direction, and
- a thickness of the second metal support layer of each of the first wiring support portion and the second wiring support portion is thinner than the thickness of the second metal support layer of the terminal support portion.
7 more elements
A wiring circuit board comprising:
- an insulating layer;
- a conductive pattern disposed on one side of the insulating layer in a thickness direction and having a first terminal, a second terminal, a first wiring connected to the first terminal, and a second wiring connected to the second terminal and disposed spaced from the first wiring;
- and
- a metal support layer disposed on the other side of the insulating layer in the thickness direction and having a terminal support portion supporting the first terminal and the second terminal, a first wiring support portion supporting the first wiring, and a second wiring support portion supporting the second wiring and disposed spaced from the first wiring support portion,
- wherein a thickness of each of the first wiring support portion and the second wiring support portion is thinner than the thickness of the terminal support portion;
- and
- wherein the terminal support portion has
- a first metal support layer,
- a second metal support layer disposed between the first metal support layer and the insulating layer in the thickness direction, and
- a third metal support layer disposed between the second metal support layer and the insulating layer in the thickness direction, wherein
- each of the first wiring support portion and the second wiring support portion has the first metal support layer and the third metal support layer, and does not have the second metal support layer.
8 more elements
Dependencies are inferred from the claim text.