Back to results
US 2026/0101435 A1Published application
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsHayato TAKAKURA, Hiroki YAMAGUCHI, Tomoaki TANAKA
Life of this patent
Estimating the term…
Abstract
A wiring circuit board includes a metal support board, an insulating layer disposed on one surface in a thickness direction of the metal support board, and a conductive pattern disposed on one surface in the thickness direction of the insulating layer. The conductive pattern includes a wiring, and the wiring includes a first wiring, a second wiring, and a third wiring. A thickness T2 of the second wiring is thicker than a thickness T1 of the first wiring, and a thickness T3 of the third wiring is thicker than the thickness T2 of the second wiring.
Claims9
A wiring circuit board comprising:
- a metal support board,
- an insulating layer disposed on one surface in a thickness direction of the metal support board, and
- a conductive pattern disposed on one surface in the thickness direction of the insulating layer,
- wherein
- the conductive pattern includes a wiring;
- the wiring includes a first wiring, a second wiring, and a third wiring;
- a thickness T2 of the second wiring is thicker than a thickness T1 of the first wiring;
- and
- a thickness T3 of the third wiring is thicker than the thickness T2 of the second wiring.
6 more elements
Dependencies are inferred from the claim text.