H05K 2201/09672
Superposed layout, i.e. in different planes
H05K2201/09672 (Superposed layout, i.e. in different planes) appears on 651 US grants and 655 published applications in this corpus.
Search patents in H05K- Granted patents
- 651
- Published applications
- 655
- Assignees
- 372
- Inventors
- 1,404
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 11 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 14 | 9 |
| 2002 | 19 | 17 |
| 2003 | 28 | 27 |
| 2004 | 16 | 25 |
| 2005 | 19 | 32 |
| 2006 | 25 | 26 |
| 2007 | 16 | 34 |
| 2008 | 24 | 29 |
| 2009 | 23 | 43 |
| 2010 | 26 | 31 |
| 2011 | 26 | 19 |
| 2012 | 32 | 25 |
| 2013 | 22 | 21 |
| 2014 | 19 | 34 |
| 2015 | 28 | 32 |
| 2016 | 21 | 22 |
| 2017 | 27 | 26 |
| 2018 | 22 | 23 |
| 2019 | 25 | 21 |
| 2020 | 18 | 27 |
| 2021 | 23 | 27 |
| 2022 | 25 | 41 |
| 2023 | 30 | 29 |
| 2024 | 21 | 16 |
| 2025 | 23 | 12 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High density skip layer transmission line with plated slot19 May 2026US 12,635,064 B2Intel Corporation
- System and method for reducing power losses for magnetics integrated in a printed circuit board24 Mar 2026US 12,586,709 B2Rockwell Automation Technologies, Inc.
- Printed circuit board comprising ground wire24 Mar 2026US 12,588,136 B2Samsung Electronics Co., Ltd.
- Capacitance sensor and method for producing capacitance sensor17 Mar 2026US 12,578,494 B2Fujikura Ltd.
- Capacitor in a substrate via6 Jan 2026US 12,520,426 B2Intel Corporation
- Package comprising substrate with improved inductor alignment and/or spacing25 Jun 2026US 2026/0182409 A1QUALCOMM Incorporated
- Circuit board structure23 Apr 2026US 2026/0113838 A1MLMTEK Co., Ltd.
- Circuit board19 Feb 2026US 2026/0052625 A1Jpc Connectivity Inc.
- Multilayer wiring board and electronic device including the same5 Feb 2026US 2026/0040431 A1Fujitsu Limited
- Multi-phase power converter circuit layout to minimize drive loop and power loop inductances29 Jan 2026US 2026/0031717 A1
Most cited
By later US patents
- Microstrip arrangement220US 6,266,016 B1Telefonaktiebolaget LM Ericsson (publ) · 2001
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001
- Circuit assemblies of printed circuit boards and telecommunications connectors167US 5,326,284 ANorthern Telecom Limited · 1994
- Disk drive comprising stacked and stepped traces for improved transmission line performance165US 8,289,656 B1Western Digital Technologies, Inc. · 2012
- Capacitor employing both fringe and plate capacitance and method of manufacture thereof138US 6,661,638 B2Avaya Technology Corp. · 2003