Printed circuit board comprising ground wire

A printed circuit board comprising:

• a first layer comprising a first ground including a first opening and a first ground wire within the first opening;
• a second layer disposed in a direction from the first layer and comprising a second ground including a second opening and a second ground wire within the second opening, wherein the second opening at least partially overlaps with the first opening;
• a third layer between the first layer and the second layer and including a third opening, a first via pad within the third opening, and a first wire line extending from the first via pad, wherein the third opening at least partially overlaps with the first opening;
• a fourth layer between the second layer and the third layer and including a fourth opening, a second via pad within the fourth opening, and a second wire line extending from the second via pad, wherein the fourth opening at least partially overlaps with the third opening;
• and
• a via at least partially surrounded by the first via pad and the second via pad,
• wherein at least a portion of the first via pad and a least a portion of the first wire line are in a same first horizontal plane and extend along the same first horizontal plane,
• wherein at least a portion of the second via pad and at least a portion of the second wire line are in a same second horizontal plane and extend along the same second horizontal plane,
• wherein the first ground wire at least partially overlaps with the first via pad and the first wire line, and extends along the first wire line, and
• wherein the second ground wire at least partially overlaps with the second via pad and the second wire line, and extends along the second wire line.