High density skip layer transmission line with plated slot
AssigneeIntel Corporation
InventorCarlos Mariscal
Life of this patent
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Abstract
Methods and apparatus relating to a high density skip layer transmission line with a plated slot are described. In one embodiment, a printed circuit board includes a plurality of transmission lines. A first transmission from the plurality of transmission lines includes a first signal trace and a first ground plane and a first plated slot coupled to a second plated slot via the first ground plane. A ground shield is formed by the first plated slot, the second plated slot, the first ground plane, and a second ground plane. The ground shield surrounds the first signal trace to reduce crosstalk between signal traces. Other embodiments are also claimed and disclosed.
Claims20
A printed circuit board comprising:
- a plurality of transmission lines, wherein a first transmission line from the plurality of transmission lines includes a first signal trace with an associated longitudinal length and a first ground plane;
- and
- a first plated slot coupled to a second plated slot via the first ground plane,
- wherein a ground shield is to be formed by the first plated slot, the second plated slot, the first ground plane, and a second ground plane, wherein the ground shield is to surround the first signal trace to reduce crosstalk between signal traces, and wherein the first and second plated slots each include a continuous portion extending along the longitudinal length.
A system comprising:
- a motherboard having a switch and a transceiver connector;
- a plurality of transmission lines to couple the switch to the transceiver connector, wherein a first transmission from the plurality of transmission lines includes a first signal trace and a first ground plane;
- and
- a first plated slot coupled to a second plated slot via the first ground plane,
- wherein a ground shield is to be formed by the first plated slot, the second plated slot, the first ground plane, and a second ground plane, wherein the ground shield is to surround the first signal trace to reduce crosstalk between signal traces, wherein adjacent signal traces are to be offset in depth within the motherboard.
Dependencies are inferred from the claim text.