Package comprising substrate with improved inductor alignment and/or spacing
AssigneeQUALCOMM Incorporated
InventorsHeun Gun SHIN, Kyudong KANG
Life of this patent
Estimating the term…
Abstract
A substrate comprising at least one dielectric layer; a plurality of interconnects comprising: a first plurality of trace interconnects located on a first metal layer of the substrate, wherein the first plurality of trace interconnects are configured as one or more coils of a first inductor; and a second plurality of trace interconnects located on a second metal layer of the substrate, wherein the first plurality of trace interconnects are configured as one or more coils of a second inductor, at least one cavity in the at least one dielectric layer; and a solder resist layer located at least partially in the at least one cavity in the at least one dielectric layer.
Claims20
A substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects comprising:
- a first plurality of trace interconnects located on a first metal layer of the substrate, wherein the first plurality of trace interconnects are configured as one or more coils of a first inductor;
- and
- a second plurality of trace interconnects located on a second metal layer of the substrate, wherein the first plurality of trace interconnects are configured as one or more coils of a second inductor;
- at least one cavity in the at least one dielectric layer;
- and
- a solder resist layer located at least partially in the at least one cavity in the at least one dielectric layer.
A substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects comprising:
- a first plurality of trace interconnects located on a first metal layer of the substrate, wherein the first plurality of trace interconnects are configured as one or more coils of a first inductor;
- and
- a second plurality of trace interconnects located on a second metal layer of the substrate, wherein the first plurality of trace interconnects are configured as one or more coils of a second inductor;
- at least one cavity in the at least one dielectric layer;
- and
- another dielectric layer located at least partially in the at least one cavity in the at least one dielectric layer.
Dependencies are inferred from the claim text.