System and method for reducing power losses for magnetics integrated in a printed circuit board

A method of integrating a magnetic component in a circuit board, the method comprising the steps of:

• defining a plurality of traces for a circuit board, the circuit board including at least three consecutive layers and an opening extending therethrough, wherein:
• the at least three consecutive layers of the circuit board include a first layer, a second layer, and a third layer,
• the plurality of traces includes at least one trace on each of the at least three consecutive layers of the circuit board,
• the at least one trace on each layer extends around the opening through the circuit board to define a plurality of loops on the respective layer,
• the plurality of loops on each of the at least three consecutive layers define an inner trace proximate the opening through the circuit board, an outer trace distal from the opening extending through the circuit board, and at least one intermediate trace located between the inner trace and the outer trace,
• the inner trace on each layer has a first axis that extends through the inner trace on each of the at least three consecutive layers,
• the at least one intermediate trace on each layer has a second axis that extends through the at least one intermediate trace on each of the at least three consecutive layers,
• the outer trace on each layer has a third axis that extends through the outer trace on each of the at least three consecutive layers, and
• at least one of the first axis, the second axis, or the third axis for the inner trace, the at least one intermediate trace, or the outer trace on the second layer is offset from the first axis, the second axis, or the third axis for the inner trace, the at least one intermediate trace, or the outer trace on the first layer,
• at least one of the first axis, the second axis, or the third axis for the inner trace, the at least one intermediate trace, or the outer trace on the third layer is offset from the first axis, the second axis, or the third axis for a corresponding inner trace, a corresponding intermediate trace, or a corresponding outer trace on the second layer, wherein the first axis, the second axis, or the third axis offset between the first layer and the second layer is offset in a common direction as the first axis, second axis, or third axis is offset between the second layer and the third layer,
• the inner trace, the at least one intermediate trace, or the outer trace on the first layer has a first sectional profile,
• the inner trace, the at least one intermediate trace, or the outer trace on the second layer has a second sectional profile, different than the first sectional profile, and
• the inner trace, the at least one intermediate trace, or the outer trace on the third layer has a third sectional profile, different than the first sectional profile and the second section profile;
• and
• mounting a core to the circuit board, wherein a portion of the core is inserted through the opening and the core extends laterally over at least a portion of the plurality of traces.